Adeia and UMC Strengthen Semiconductor Partnership
On March 11, 2026, Adeia Inc. announced the expansion and renewal of its intellectual property licensing agreement with United Microelectronics Corporation (UMC), according to GlobeNewswire PE. The agreement provides UMC with continued access to Adeia’s semiconductor portfolio, including hybrid bonding technologies, and extends their collaboration to future generations of 3D integration and advanced packaging solutions.
Details of the Expanded Agreement
The new agreement allows UMC to leverage Adeia’s innovations in hybrid bonding and advanced packaging, which enable tighter interconnect pitch, improved power efficiency, greater bandwidth, and increased reliability for applications in logic, memory, AI accelerators, and high-performance computing devices. Steven Hsu, Vice President of Technology Development at UMC, stated that the partnership has unlocked value for customers through 3D integration of RFSOI wafers for RF front-end modules, as per the announcement. Dr. Mark Kokes, chief revenue officer of Adeia, noted that the collaboration reflects the strength of Adeia’s IP portfolio in supporting UMC’s advancements in 3D integration and heterogeneous packaging.
Company Backgrounds
Adeia Inc., based in San Jose, California, is a technology company that develops innovations for the semiconductor and media industries, with its IP broadly licensed across the global ecosystem for over 30 years, according to GlobeNewswire PE. UMC is a leading global semiconductor foundry that focuses on providing advanced packaging services to meet demands in AI, networking, and automotive applications. As a widely-known context, semiconductor collaborations like this one are common in the tech industry to drive innovation in high-performance computing.
Implications for Technology Development
Adeia’s semiconductor IP includes industry-defining technologies in hybrid bonding and advanced interconnects, which support high-density and high-efficiency device architectures. This agreement builds on their long-term relationship, enabling UMC to expand services for integrating different types of wafers for next-generation applications, as detailed in the source.
